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Invention Grant
US09084351B2 Structure and circuit board having repeatedly arranged connection members 有权
结构和电路板具有重复布置的连接构件

Structure and circuit board having repeatedly arranged connection members
Abstract:
A structure (10) includes a conductor (151), conductors (111, 131) that are located on the same side with respect to the conductor (151), that are opposed to at least a part of the conductor (151), and that overlap each other when seen in a plan view, a connection member (101) that penetrates the conductors (111, 131, 151), that is connected to the conductor (151), and that is insulated from the conductors (111, 131), openings (112, 132) that are formed in the conductors (111, 131), respectively, and which the connection member (101) passes through, and conductor elements (121, 141) that are formed to be opposed to the openings (112, 132), that are connected to the connection member (101) passing through the openings (112, 132), and that are larger than the openings (112, 132). The number of layers in which the conductor elements (121, 141) are located is two or more and less than or equal to the number of layers in which the conductors (111, 131) are located.
Abstract(Chinese):

结构（10）包括导体（151），相对于导体（151）位于同一侧的与导体（151）的至少一部分相对的导体（111,131），以及 在平面图中看到彼此重叠的连接构件（101），其连接到与导体（151）连接并且与导体（111,131）绝缘的导体（111,131,151） ），分别形成在导体（111,131）中并且连接构件（101）通过的开口（112,132）以及形成为与开口相对的导体元件（121,141） （112,132），其连接到穿过所述开口（112,132）的所述连接构件（101），并且大于所述开口（112,132）。 导体元件（121,141）所在的层数为两个以上且小于等于导体（111,131）所在的层数。

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