发明授权
US09084359B2 Wired circuit board having enhanced contrast between conductive pattern and insulating layer during inspection
有权
有线电路板在检查期间具有增强的导电图案和绝缘层之间的对比度
- 专利标题： Wired circuit board having enhanced contrast between conductive pattern and insulating layer during inspection
- 专利标题（中）： 有线电路板在检查期间具有增强的导电图案和绝缘层之间的对比度
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申请号： US13137300申请日： 2011-08-04
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公开(公告)号： US09084359B2公开(公告)日： 2015-07-14
- 发明人: Norihiko Okamoto
- 申请人： Norihiko Okamoto
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 代理机构： Edwards Neils PLLC
- 代理商 Jean C. Edwards, Esq.
- 优先权： JP2010-198788 20100906
- 主分类号： H05K3/10
- IPC分类号： H05K3/10 ; G11B5/48 ; H05K1/02
摘要：
A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.
公开/授权文献
- US20120055697A1 Wired circuit board and producing method thereof 公开/授权日：2012-03-08
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