发明授权
- 专利标题: Wiring substrate, light emitting device, and manufacturing method of wiring substrate
- 专利标题(中): 配线基板,发光元件及布线基板的制造方法
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申请号: US13749070申请日: 2013-01-24
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公开(公告)号: US09084372B2公开(公告)日: 2015-07-14
- 发明人: Shigetsugu Muramatsu , Hiroshi Shimizu , Yasuyoshi Horikawa
- 申请人: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 申请人地址: JP Nagano-shi, Nagano
- 专利权人: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址: JP Nagano-shi, Nagano
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2012-013243 20120125
- 主分类号: H05K7/00
- IPC分类号: H05K7/00 ; F21V7/00 ; C25D5/02 ; H05K7/20 ; H05K3/46 ; F21K99/00 ; H05K1/02 ; H05K1/05 ; H05K3/34
摘要:
There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer.
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