发明授权
- 专利标题: Heat sink cooling arrangement for multiple power electronic circuits
- 专利标题(中): 多功率电子电路的散热片冷却装置
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申请号: US13711372申请日: 2012-12-11
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公开(公告)号: US09084376B2公开(公告)日: 2015-07-14
- 发明人: Bruce W. Weiss
- 申请人: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
- 申请人地址: US OH Mayfield Heights
- 专利权人: Rockwell Automation Technologies, Inc.
- 当前专利权人: Rockwell Automation Technologies, Inc.
- 当前专利权人地址: US OH Mayfield Heights
- 代理机构: Fletcher Yoder P.C.
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H05K13/00
摘要:
The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems including heat sinks with separate, sequential heat sink fin sections disposed in a common cooling air path and having different geometries to optimize the flow of cooling air across and between fins of the separate heat sink fin sections. For example, the heat sink fin sections may have different fin lengths, fin heights, fin counts, fin pitch (e.g., distance between adjacent fins), and so forth. Each of these different geometric characteristics may be tuned to ensure that temperatures and temperature gradients across the heat sinks are maintained within acceptable ranges.
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