Invention Grant
- Patent Title: Thin profile conductor assembly for medical device leads
- Patent Title (中): 用于医疗器械引线的薄型导体组件
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Application No.: US12704939Application Date: 2010-02-12
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Publication No.: US09084883B2Publication Date: 2015-07-21
- Inventor: Torsten Scheuermann
- Applicant: Torsten Scheuermann
- Applicant Address: US MN St. Paul
- Assignee: Cardiac Pacemakers, Inc.
- Current Assignee: Cardiac Pacemakers, Inc.
- Current Assignee Address: US MN St. Paul
- Agency: Faegre Baker Daniels LLP
- Main IPC: A61N1/02
- IPC: A61N1/02 ; A61N1/05 ; A61N1/08

Abstract:
A medical device lead includes a thin profile conductor assembly. A proximal connector includes a proximal end that is configured to couple the lead to a pulse generator. An insulative lead body extends distally from the proximal connector. The conductor assembly extends distally from the proximal end within the lead body and includes a non-conductive tubular core member that defines a lumen, an outer insulative layer, and a multilayer conductor between the tubular core member and the outer insulative layer. The multilayer conductor is electrically connected to the proximal connector and includes a first conductive layer adjacent to the tubular core member and a second conductive layer adjacent to the first conductive layer opposite the tubular core member. A conductivity of the second conductive layer is greater than a conductivity of the first conductive layer.
Public/Granted literature
- US20100234929A1 THIN PROFILE CONDUCTOR ASSEMBLY FOR MEDICAL DEVICE LEADS Public/Granted day:2010-09-16
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