Invention Grant
- Patent Title: Film adhering mechanism
- Patent Title (中): 胶片粘附机制
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Application No.: US14060853Application Date: 2013-10-23
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Publication No.: US09085108B2Publication Date: 2015-07-21
- Inventor: Chao Shen
- Applicant: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Zhejiang TW New Taipei
- Assignee: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Zhejiang TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201220718520U 20121224
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B29C63/00 ; B29C63/02

Abstract:
A film adhering mechanism includes a base, a film adsorbing platform, at least two flexible members, a vacuum generator; and an electromagnetic valve. The film adsorbing platform includes a main body positioned on the base, and a protective pad covered on the main body away from the base. The at least two flexible members are separately mounted on the base, and pass through the main body and the protective pad, and protrude from the protective pad. A gas inlet and a first adsorbing hole communicating with the gas inlet are defined in the main body. A second adsorbing hole is defined in the protective pad communicating with the first adsorbing hole. The vacuum generator communicates with the gas inlet, and the electromagnetic valve controls the vacuum generator.
Public/Granted literature
- US20140174668A1 FILM ADHERING MECHANISM Public/Granted day:2014-06-26
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