Invention Grant
- Patent Title: Encapsulated particle
- Patent Title (中): 封装颗粒
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Application No.: US14115375Application Date: 2012-05-04
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Publication No.: US09085495B2Publication Date: 2015-07-21
- Inventor: Raymond Neff , Alexander Gershanovich , Donald C. Mente , Rajesh Kumar
- Applicant: Raymond Neff , Alexander Gershanovich , Donald C. Mente , Rajesh Kumar
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Howard & Howard Attorneys PLLC
- International Application: PCT/US2012/036563 WO 20120504
- International Announcement: WO2012/151506 WO 20121108
- Main IPC: C05C9/00
- IPC: C05C9/00 ; C05G3/00

Abstract:
An encapsulated particle including a core particle, a base layer, and an outer layer is provided. The base layer is disposed about the core particle and comprises polycarbodiimide. The outer layer is disposed about the base layer and comprises wax. A method of forming the encapsulated particle including the steps of reacting an isocyanate in the presence of a catalyst to form the polycarbodiimide, encapsulating the core particle with the polycarbodiimide to form the base layer, and encapsulating the base layer with the wax to form the outer layer is also provided.
Public/Granted literature
- US20140060133A1 Encapsulated Particle Public/Granted day:2014-03-06
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