Invention Grant
- Patent Title: Semiconductor devices including unitary supports
- Patent Title (中): 半导体器件包括单一支撑
-
Application No.: US14336334Application Date: 2014-07-21
-
Publication No.: US09087729B2Publication Date: 2015-07-21
- Inventor: Sang-Oh Park , Chang-Hwan Kim , Whan Namkoong , Jun-Young Jang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2013-0095598 20130812
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L23/00 ; H01L49/02

Abstract:
A semiconductor device includes a plurality of cylindrical structures located at vertices and central points of a plurality of hexagons in a honeycomb pattern, and a unitary support having a plurality of openings. Each of the openings exposes a part each of four of the cylindrical structures. Each of the openings has the shape of a parallelogram or an oval substantially. A first distance between opposite cylindrical structures of a first pair of the four cylindrical structures exposed by each opening is shorter than a second distance between opposite cylindrical structures of a second pair of the four cylindrical structures exposed by the opening. The first distance is equal to a distance between the central point and each of the vertices of the hexagon.
Public/Granted literature
- US20150041973A1 SEMICONDUCTOR DEVICES INCLUDING UNITARY SUPPORTS Public/Granted day:2015-02-12
Information query
IPC分类: