发明授权
- 专利标题： Adhesive wafer bonding with controlled thickness variation
- 专利标题（中）： 粘合剂晶片粘合，控制厚度变化
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申请号： US13952450申请日： 2013-07-26
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公开(公告)号： US09087764B2公开(公告)日： 2015-07-21
- 发明人: Clayton Ka Tsun Chan , Andreas Bibl
- 申请人： LuxVue Technology Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Luxvue Technology Corporation
- 当前专利权人： Luxvue Technology Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L29/18
- IPC分类号： H01L29/18 ; H01L33/00 ; H01L27/15 ; H01L33/06
摘要：
A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.
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