Invention Grant
- Patent Title: Off substrate kinking of bond wire
- Patent Title (中): 关闭接合线的基板扭结
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Application No.: US14077597Application Date: 2013-11-12
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Publication No.: US09087815B2Publication Date: 2015-07-21
- Inventor: Belgacem Haba , Reynaldo Co , Rizza Lee Saga Cizek , Wael Zohni
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H01L23/00 ; B23K20/00

Abstract:
An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Tensioning the wire using the bonding tool causes the wire to break and define an end. The lead then extends from the metal surface to the end.
Public/Granted literature
- US20150129646A1 OFF SUBSTRATE KINKING OF BOND WIRE Public/Granted day:2015-05-14
Information query
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