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US09087883B2 Method and apparatus for stacked semiconductor chips 有权
层叠半导体芯片的方法和装置

Method and apparatus for stacked semiconductor chips
Abstract:
Stacked semiconductor chips include a bonding-wire-free interconnection electrically connecting the semiconductor chips to each. An opening in an adhesion layer between the semiconductor chips may provide a path for the interconnection from a bonding pad on one semiconductor chip, along a sidewall insulation layer of the semiconductor chip, along a sidewall insulation layer of another semiconductor chip to a bonding pad on the other semiconductor chip.
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