Invention Grant
- Patent Title: Coupling electronic receptacles to devices
- Patent Title (中): 将电子插座连接到设备
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Application No.: US13793057Application Date: 2013-03-11
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Publication No.: US09088112B1Publication Date: 2015-07-21
- Inventor: Joshua Paul Davies , Brandon Michael Potens , Andrew McIntyre , Angel Wilfredo Martinez , Kelly Erin Johnson
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Sutherland Asbill & Brennan LLP
- Main IPC: H01R12/71
- IPC: H01R12/71
Abstract:
According to one or more embodiments of the disclosure, a device is provided. The printed circuit board may include an electronic receptacle. Additionally, the printed circuit board may include a housing element housing a portion of the electronic receptacle. As such, the housing element may include a top portion, a bottom portion, and at least one side portion. To this end, the top portion of the housing element may extend above a bottom surface of the printed circuit board, and the bottom portion of the housing element may extend below the bottom surface of the printed circuit board. Moreover, the printed circuit board may include at least one spring connector coupled to the electronic receptacle and the printed circuit board.
Information query
