发明授权
- 专利标题： Power module and the method of packaging the same
- 专利标题（中）： 电源模块及其封装方法相同
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申请号： US13359466申请日： 2012-01-26
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公开(公告)号： US09088206B2公开(公告)日： 2015-07-21
- 发明人: Ho-Yin Yiu , Chien-Hung Liu , Wei-Chung Yang , Bai-Yao Lou
- 申请人： Ho-Yin Yiu , Chien-Hung Liu , Wei-Chung Yang , Bai-Yao Lou
- 代理机构： Liu & Liu
- 主分类号： H01L29/06
- IPC分类号： H01L29/06 ; H01L27/06 ; H04B1/02 ; H02M3/155 ; H02M3/00 ; H01F17/00 ; H01L23/64 ; H01L25/16 ; H01L23/00 ; H01L25/07
摘要：
A power module includes a substrate; a conductive path layer formed on the substrate with a specific pattern as an inductor; a connection layer being formed on the substrate and electrically connected to a first terminal of the inductor; and a first transistor, electrically mounted on the substrate through the connection layer.
公开/授权文献
- US20120194148A1 POWER MODULE AND THE METHOD OF PACKAGING THE SAME 公开/授权日：2012-08-02
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