Invention Grant
- Patent Title: Power module and the method of packaging the same
- Patent Title (中): 电源模块及其封装方法相同
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Application No.: US13359466Application Date: 2012-01-26
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Publication No.: US09088206B2Publication Date: 2015-07-21
- Inventor: Ho-Yin Yiu , Chien-Hung Liu , Wei-Chung Yang , Bai-Yao Lou
- Applicant: Ho-Yin Yiu , Chien-Hung Liu , Wei-Chung Yang , Bai-Yao Lou
- Agency: Liu & Liu
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/06 ; H04B1/02 ; H02M3/155 ; H02M3/00 ; H01F17/00 ; H01L23/64 ; H01L25/16 ; H01L23/00 ; H01L25/07
Abstract:
A power module includes a substrate; a conductive path layer formed on the substrate with a specific pattern as an inductor; a connection layer being formed on the substrate and electrically connected to a first terminal of the inductor; and a first transistor, electrically mounted on the substrate through the connection layer.
Public/Granted literature
- US20120194148A1 POWER MODULE AND THE METHOD OF PACKAGING THE SAME Public/Granted day:2012-08-02
Information query
IPC分类:
