Invention Grant
- Patent Title: Frame kits and frames
- Patent Title (中): 框架套件和框架
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Application No.: US13558729Application Date: 2012-07-26
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Publication No.: US09089229B2Publication Date: 2015-07-28
- Inventor: Francois K Pirayesh , Xiaoqi Zhou , David Edmondson , Alan M Jacques
- Applicant: Francois K Pirayesh , Xiaoqi Zhou , David Edmondson , Alan M Jacques
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Dierker & Associates
- Main IPC: A47G1/10
- IPC: A47G1/10 ; A47G1/06 ; B29C44/18

Abstract:
Frame kits and frames are disclosed herein. In an example, a frame kit includes at least two frame legs. Each frame leg has two edges, where one of the two edges of each frame leg is to abut another of the two edges of an adjacent frame leg when a frame is constructed with the frame legs. Each frame leg includes a non-foamed polymer exterior wall; a hollow space defined by the non-foamed polymer exterior wall; and an expanded foam material positioned within the hollow space.
Public/Granted literature
- US20140026456A1 FRAME KITS AND FRAMES Public/Granted day:2014-01-30
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