发明授权
- 专利标题: Semiconductor structure and process thereof
- 专利标题(中): 半导体结构及其工艺
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申请号: US13848736申请日: 2013-03-22
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公开(公告)号: US09093285B2公开(公告)日: 2015-07-28
- 发明人: Ching-Wen Hung , Chih-Sen Huang , Po-Chao Tsao
- 申请人: UNITED MICROELECTRONICS CORP.
- 申请人地址: TW Science-Based Industrial Park, Hsin-Chu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Science-Based Industrial Park, Hsin-Chu
- 代理商 Winston Hsu; Scott Margo
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L27/06 ; H01L21/28 ; H01L49/02 ; H01L29/49 ; H01L29/51 ; H01L29/66
摘要:
A semiconductor structure includes a metal gate, a second dielectric layer and a contact plug. The metal gate is located on a substrate and in a first dielectric layer, wherein the metal gate includes a work function metal layer having a U-shaped cross-sectional profile and a low resistivity material located on the work function metal layer. The second dielectric layer is located on the metal gate and the first dielectric layer. The contact plug is located on the second dielectric layer and in a third dielectric layer, thereby a capacitor is formed. Moreover, the present invention also provides a semiconductor process forming said semiconductor structure.
公开/授权文献
- US20140284671A1 SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF 公开/授权日:2014-09-25
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