发明授权
- 专利标题： Connector structures of integrated circuits
- 专利标题（中）： 集成电路的连接器结构
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申请号： US14260627申请日： 2014-04-24
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公开(公告)号： US09093440B2公开(公告)日： 2015-07-28
- 发明人: Shang-Yun Tu , Yao-Chun Chuang , Ming Hung Tseng , Chen-Cheng Kuo , Chen-Shien Chen
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/31 ; H01L23/00
摘要：
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.
公开/授权文献
- US20140231987A1 Connector Structures of Integrated Circuits 公开/授权日：2014-08-21
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