Invention Grant
- Patent Title: Fin structure of semiconductor device
- Patent Title (中): 半导体器件的鳍结构
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Application No.: US13915441Application Date: 2013-06-11
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Publication No.: US09093531B2Publication Date: 2015-07-28
- Inventor: Chung-Hsien Chen , Tung Ying Lee , Yu-Lien Huang , Chi-Wen Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/04 ; H01L29/06 ; H01L29/78

Abstract:
The disclosure relates to a fin structure of a semiconductor device. An exemplary fin structure for a semiconductor device comprises a lower portion protruding from a major surface of a substrate, wherein the lower portion comprises a first semiconductor material having a first lattice constant; an upper portion having an interface with the lower portion, wherein the upper portion comprises a second semiconductor material having a second lattice constant different from the first lattice constant; a first pair of notches lower than the interface and extending into opposite sides of the lower portion, wherein each first notch have a first width; and a second pair of notches extending into opposite sides of the interface, wherein each second notch have a second width greater than the first width.
Public/Granted literature
- US20140361336A1 Fin Structure of Semiconductor Device Public/Granted day:2014-12-11
Information query
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