发明授权
- 专利标题： Method for manufacturing printed circuit board
- 专利标题（中）： 印刷电路板制造方法
-
申请号： US13688413申请日： 2012-11-29
-
公开(公告)号： US09095064B2公开(公告)日： 2015-07-28
- 发明人: Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
- 申请人： Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
- 申请人地址： JP Ibaraki-shi, Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Ibaraki-shi, Osaka
- 代理机构： Panitch Schwarze Belisario & Nadel LLP
- 优先权： JP2009-077246 20090326
- 主分类号： H05K3/02
- IPC分类号： H05K3/02 ; H05K3/10 ; G11B5/48 ; H05K1/02 ; H05K1/05 ; H05K3/28
摘要：
A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
公开/授权文献
- US20130087271A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 公开/授权日：2013-04-11