发明授权
- 专利标题: Electrical contact for implantable medical device
- 专利标题(中): 可植入医疗器械的电接点
-
申请号: US12555431申请日: 2009-09-08
-
公开(公告)号: US09095728B2公开(公告)日: 2015-08-04
- 发明人: Darren A. Janzig , Chris J. Paidosh , Paulette C. Olson , Gerald G. Lindner
- 申请人: Darren A. Janzig , Chris J. Paidosh , Paulette C. Olson , Gerald G. Lindner
- 申请人地址: US MN Minneapolis
- 专利权人: Medtronic, Inc.
- 当前专利权人: Medtronic, Inc.
- 当前专利权人地址: US MN Minneapolis
- 代理机构: Mueting, Raasch & Gebhardt, P.A.
- 主分类号: A61N1/375
- IPC分类号: A61N1/375 ; H01R13/11 ; H01R24/58 ; H01R107/00
摘要:
A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.
公开/授权文献
- US20100063555A1 ELECTRICAL CONTACT FOR IMPLANTABLE MEDICAL DEVICE 公开/授权日:2010-03-11