Invention Grant
- Patent Title: Optoelectronic chips including coupler region and methods of manufacturing the same
- Patent Title (中): 包括耦合器区域的光电芯片及其制造方法
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Application No.: US13768204Application Date: 2013-02-15
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Publication No.: US09097845B2Publication Date: 2015-08-04
- Inventor: Seong-ho Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0113581 20111102; KR10-2012-0123755 20121102
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H01L21/82 ; G02B6/134
Abstract:
An optoelectronic chip, and/or a method of manufacturing the same, include a substrate; a coupler region surrounded by the substrate. The coupler region includes a total reflection surface. The total reflection surface is configured to totally reflect a first light incident through a surface of the substrate such that the reflected first light travels within the substrate, or the total reflection surface is configured to totally reflect a second light guided in the substrate and incident on the total reflecting surface such that the reflected second light travels through the surface of the substrate.
Public/Granted literature
- US20130163919A1 OPTOELECTRONIC CHIPS INCLUDING COUPLER REGION AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2013-06-27
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