发明授权
US09099458B2 Construction of reliable stacked via in electronic substrates—vertical stiffness control method
有权
在电子基板中构建可靠的堆叠通孔 - 垂直刚度控制方法
- 专利标题： Construction of reliable stacked via in electronic substrates—vertical stiffness control method
- 专利标题（中）： 在电子基板中构建可靠的堆叠通孔 - 垂直刚度控制方法
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申请号： US13539480申请日： 2012-07-01
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公开(公告)号： US09099458B2公开(公告)日： 2015-08-04
- 发明人: Karan Kacker , Douglas O. Powell , David L. Questad , David J. Russell , Sri M. Sri-Jayantha
- 申请人： Karan Kacker , Douglas O. Powell , David L. Questad , David J. Russell , Sri M. Sri-Jayantha
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Tutunjian & Bitetto, P.C.
- 代理商 Vazken Alexanian
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/09 ; H01L23/498 ; H05K3/46 ; H05K1/02
摘要：
A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes an etched pattern.
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