Invention Grant
- Patent Title: Semiconductor light emitting device and package
- Patent Title (中): 半导体发光器件和封装
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Application No.: US13677072Application Date: 2012-11-14
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Publication No.: US09099624B2Publication Date: 2015-08-04
- Inventor: Wan Ho Lee , Gi Bum Kim , Si Hyuk Lee
- Applicant: Samsung Electronics Co., Ltd
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0118101 20111114
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L33/44

Abstract:
A semiconductor light emitting device and package containing the same include: a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. A light extraction layer is disposed on the light emitting structure and includes a light-transmissive thin film layer having light transmittance, a nano-rod layer including nano-rods disposed on the light-transmissive thin film layer, and a nano-wire layer including nano-wires disposed on the nano-rod layer.
Public/Granted literature
- US20130119423A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND PACKAGE Public/Granted day:2013-05-16
Information query
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