Invention Grant
- Patent Title: Molding apparatus and molding method
- Patent Title (中): 成型设备及成型方法
-
Application No.: US13230196Application Date: 2011-09-12
-
Publication No.: US09102093B2Publication Date: 2015-08-11
- Inventor: Takehiko Sumi , Tadatoshi Tanji , Kenji Iwasaki
- Applicant: Takehiko Sumi , Tadatoshi Tanji , Kenji Iwasaki
- Applicant Address: JP Kyoto
- Assignee: KYORAKU CO., LTD.
- Current Assignee: KYORAKU CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2010-206137 20100914; JP2011-042930 20110228; JP2011-042939 20110228; JP2011-042950 20110228; JP2011-046924 20110303; JP2011-046926 20110303
- Main IPC: B29C51/02
- IPC: B29C51/02 ; B29C51/00 ; B29C51/30 ; B29C47/36 ; B29C65/78 ; B29C47/00 ; B29K503/04 ; B29K96/04 ; B29L31/30 ; B29L23/00 ; B29C47/04 ; B29C47/08 ; B29C47/16 ; B29K23/00 ; B29C47/34 ; B29C47/54 ; B29C49/00 ; B29K105/04 ; B29C51/10 ; B29C51/26 ; B29C49/04 ; B29C49/42 ; B29K101/12
Abstract:
The present invention provides a molding apparatus by which it is possible to make a frame located around a mold contact thermoplastic resin. In the molding apparatus of the present invention, the thermoplastic resin extruded from an extruding machine in a sheet form is adsorbed onto a cavity surface of the mold. As a result, the thermoplastic resin is shaped into a shape according to the cavity surface. The molding apparatus includes a frame that is positioned around the mold and is movable relative to the mold. In the frame, a suction part to suck the thermoplastic resin is provided.
Public/Granted literature
- US20120061886A1 MOLDING APPARATUS AND MOLDING METHOD Public/Granted day:2012-03-15
Information query
