Invention Grant
- Patent Title: Super junction semiconductor device
- Patent Title (中): 超结半导体器件
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Application No.: US14189295Application Date: 2014-02-25
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Publication No.: US09105487B2Publication Date: 2015-08-11
- Inventor: Hans-Joachim Schulze , Johannes Laven , Dieter Fuchs , Werner Schustereder , Roman Knoefler
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L21/265 ; H01L29/739 ; H01L29/78 ; H01L29/10 ; H01L29/861 ; H01L29/08 ; H01L29/16

Abstract:
A super junction semiconductor device includes a substrate layer of a first conductivity type and an epitaxial layer adjoining the substrate layer and including first columns of the first conductivity type and second columns of a second conductivity type. The first and second columns extend along a main crystal direction into the epitaxial layer and have vertical dopant profiles perpendicular to the first surface. The vertical dopant profile of at least one of the first and second columns includes first portions separated by second portions. In each of the first portions a dopant concentration varies by at most 30% of a maximum value within the respective first portion. In the second portions the dopant concentration is lower than in the adjoining first portions. A ratio of a total length of the first portions to a total length of the first and second portions is at least 50%.
Public/Granted literature
- US20140175593A1 Super Junction Semiconductor Device Public/Granted day:2014-06-26
Information query
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