Invention Grant
- Patent Title: Package-on-package device
- Patent Title (中): 封装包装器件
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Application No.: US14047120Application Date: 2013-10-07
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Publication No.: US09105503B2Publication Date: 2015-08-11
- Inventor: Yonghoon Kim , Hyo-Soon Kang , Inho Choi
- Applicant: Yonghoon Kim , Hyo-Soon Kang , Inho Choi
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0011940 20130201
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/10 ; H01L23/31 ; H01L25/065 ; H01L25/18
Abstract:
A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package. Further, data and command pads of a logic chip may be located to be adjacent to data and command pads of the memory chips. Accordingly, a routing distance between pads can be contracted and thus signal delivery speed can be improved. This makes it possible to improve an operation speed of the device.
Public/Granted literature
- US20140217586A1 PACKAGE-ON-PACKAGE DEVICE Public/Granted day:2014-08-07
Information query
IPC分类:
