Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14212663Application Date: 2014-03-14
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Publication No.: US09105607B2Publication Date: 2015-08-11
- Inventor: Jaejune Jang , JaeHyun Jung
- Applicant: SAMSUNG ELECTRONICS Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0028147 20130315
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/092 ; H01L29/78 ; H01L29/04 ; H01L29/06 ; H01L21/8238 ; H01L27/02 ; H01L29/165

Abstract:
A semiconductor device includes a semiconductor substrate of a first conductivity type, a mesh-type gate electrode including first portions extending in a first direction and second portions extending in a second direction crossing the first direction over the substrate. The mesh-type gate structure may have a plurality of openings, and source regions and drain regions of second conductivity type alternately arranged in the first direction and the second direction in the substrate at locations corresponding to the openings.
Public/Granted literature
- US20140264622A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-09-18
Information query
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