Invention Grant
- Patent Title: Implantable medical electrical leads and connector assemblies thereof
- Patent Title (中): 可植入医疗电线及其连接器组件
-
Application No.: US14133899Application Date: 2013-12-19
-
Publication No.: US09106004B2Publication Date: 2015-08-11
- Inventor: Nathan L Olson , Kevin R. Seifert
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Michael C. Soldner
- Main IPC: H01R24/58
- IPC: H01R24/58 ; A61N1/05 ; H01R13/52

Abstract:
A connector assembly of an implantable medical electrical lead includes insulation and conductor segments, which may be formed together in a molded subassembly. The insulation segment includes at least one sealing surface, and the conductor segment includes at least one contact surface and a shank electrically common therewith. The shank has a smaller diameter than a uniform outer diameter of the assembly, which is defined by the sealing and contact surfaces, and the smaller diameter is sized to receive a coiled proximal end of a lead conductor mounted thereabout. The connector assembly may include another conductor segment that has a third contact surface, active or inactive, extending between third and fourth sealing surfaces of another insulation segment of the assembly; if active, a distal shank of the segment is electrically common with the third contact surface, and sized to receive a coiled proximal end of another lead conductor mounted thereabout.
Public/Granted literature
- US20150180161A1 IMPLANTABLE MEDICAL ELECTRICAL LEADS AND CONNECTOR ASSEMBLIES THEREOF Public/Granted day:2015-06-25
Information query