Invention Grant
- Patent Title: Handling power dissipation in a multi microspeaker module
- Patent Title (中): 处理多功能扬声器模块中的功耗
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Application No.: US13937056Application Date: 2013-07-08
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Publication No.: US09106987B2Publication Date: 2015-08-11
- Inventor: Scott P. Porter , Christopher Wilk , Ruchir M. Dave
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H04R9/06
- IPC: H04R9/06 ; H04R3/00 ; H04R9/02 ; H04R9/00

Abstract:
Embodiments of the invention include a micro speaker assembly that has two drivers, each having a separate yoke, set of magnets, voice coil, and acoustic diaphragms. One driver may produce high frequency (HF) sound while the other produces low frequency (LF) sound. The two drivers may be packaged, side-by-side, within the same micro speaker acoustic enclosure. The drivers may have their respective magnet systems physically connected to each other, in order to enhance heat transfer from one to the other. In particular, a thermally conductive portion or bridge may be used to directly join or thermally connect adjacent edges of the yoke portions of the two magnet systems, in order to enhance heat transfer between the first and second micro speaker drivers. Thus, the assembly can handle more power without overheating. Other embodiments are also described and claimed.
Public/Granted literature
- US20150010175A1 HANDLING POWER DISSIPATION IN A MULTI MICROSPEAKER MODULE Public/Granted day:2015-01-08
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