Invention Grant
- Patent Title: Semiconductor structure and layout structure for memory devices
- Patent Title (中): 存储器件的半导体结构和布局结构
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Application No.: US14158875Application Date: 2014-01-20
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Publication No.: US09111796B2Publication Date: 2015-08-18
- Inventor: Zhen Chen , Shen-De Wang , Yi-Shan Chiu , Wei Cheng
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Science Based Industrial Park, Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Science Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L23/00 ; H01L27/02 ; H01L27/105

Abstract:
A layout structure for memory devices includes a plurality of first gate patterns, a plurality of first landing pad patterns, a plurality of dummy patterns, a plurality of second landing pad patterns, and a plurality of second gate patterns. The first landing pad patterns are parallel with each other and electrically connected to the first gate patterns. The dummy patterns and the first landing pad patterns are alternately arranged, and the second landing pad patterns are respectively positioned in between one first landing pad pattern and one dummy pattern. The second gate patterns are electrically connected to the second landing pad patterns.
Public/Granted literature
- US20150206894A1 SEMICONDUCTOR STRUCTURE AND LAYOUT STRUCTURE FOR MEMORY DEVICES Public/Granted day:2015-07-23
Information query
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