发明授权
- 专利标题： Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
- 专利标题（中）： 水平和垂直排列的石墨纳米纤维热界面材料用于芯片堆叠
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申请号： US13613564申请日： 2012-09-13
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公开(公告)号： US09111899B2公开(公告)日： 2015-08-18
- 发明人: Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
- 申请人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
- 申请人地址： SG Singapore
- 专利权人： Lenovo
- 当前专利权人： Lenovo
- 当前专利权人地址： SG Singapore
- 代理机构： Kunzler Law Group
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/10 ; H01L23/34 ; H01L23/367 ; H01L23/00 ; H01L21/02 ; H01L23/373 ; H01L23/427 ; H01L25/065
摘要：
The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip.