发明授权
- 专利标题： Chip arrangement with a recessed chip housing region and a method for manufacturing the same
- 专利标题（中）： 具有凹陷芯片壳体区域的芯片布置及其制造方法
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申请号： US13909158申请日： 2013-06-04
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公开(公告)号： US09111947B2公开(公告)日： 2015-08-18
- 发明人: David O'Sullivan , Thorsten Meyer
- 申请人： Intel Mobile Communications GmbH
- 申请人地址： DE Neubiberg
- 专利权人： INTEL DEUTSCHLAND GMBH
- 当前专利权人： INTEL DEUTSCHLAND GMBH
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/28 ; H01L23/04 ; H01L21/56 ; H01L23/31
摘要：
A chip arrangement may include: a semiconductor chip; an encapsulating structure at least partially encapsulating the semiconductor chip, the encapsulating structure having a first side and a second side opposite the first side, the encapsulating structure including a recess over the first side of the encapsulating structure, the recess having a bottom surface located at a first level; and at least one electrical connector disposed at the first side of the encapsulating structure outside the recess, wherein a surface of the at least one electrical connector facing the encapsulating structure may be disposed at a second level different from the first level.
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