An embodiment of an electronic communications device, including: a body of semiconductor material defining at least one integrated electronic circuit and having a top surface; an electromagnetic shield; a radiant element; and a capacitive element formed by a first electrode and a second electrode, the radiant element being set on the top surface and being ohmically coupled to the first electrode and the second electrode by means of a first connection element and a second connection element, respectively, the electromagnetic shield being set between the radiant element and the top surface and forming at least the second electrode.