发明授权
- 专利标题: Electronic circuit board, assembly and a related method thereof
- 专利标题(中): 电子电路板,组装及其相关方法
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申请号: US13563132申请日: 2012-07-31
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公开(公告)号: US09113583B2公开(公告)日: 2015-08-18
- 发明人: David Mulford Shaddock , Emad Andarawis Andarawis
- 申请人: David Mulford Shaddock , Emad Andarawis Andarawis
- 申请人地址: US NY Niskayuna
- 专利权人: General Electric Company
- 当前专利权人: General Electric Company
- 当前专利权人地址: US NY Niskayuna
- 代理商 John P. Darling
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H05K3/28
摘要:
An apparatus includes a substrate and a plurality of conductive traces formed on the substrate. The conductive traces are doped with a concentration of an aluminum material forming a protective layer as a portion of the plurality of conductive traces to inhibit oxidation. A set of first metal contact pads are formed in contact with the plurality of conductive traces. The substrate, the plurality of conductive traces and the set of first metal contact pads define an electronic circuit board configured to operate at a temperature greater than 200 degrees Celsius. A high operating temperature electronic device is configured in electrical communication with the conductive traces defining an assembly configured to operate at a temperature greater than 200 degrees Celsius.