Invention Grant
US09114897B2 Automatic packing apparatus and automatic packing method using the same
有权
自动包装设备及使用其的自动包装方法
- Patent Title: Automatic packing apparatus and automatic packing method using the same
- Patent Title (中): 自动包装设备及使用其的自动包装方法
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Application No.: US13253229Application Date: 2011-10-05
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Publication No.: US09114897B2Publication Date: 2015-08-25
- Inventor: Jin Ho Kim , Byoung Oh Park , Yong Ki Cho , Jong Soo Jeong , Bong Sup Lim , Yun Jin Jung
- Applicant: Jin Ho Kim , Byoung Oh Park , Yong Ki Cho , Jong Soo Jeong , Bong Sup Lim , Yun Jin Jung
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0097063 20101005
- Main IPC: B65B3/12
- IPC: B65B3/12 ; B65B5/02 ; B65B43/26 ; B65B43/28

Abstract:
According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.
Public/Granted literature
- US20120079796A1 AUTOMATIC PACKING APPARATUS AND AUTOMATIC PACKING METHOD USING THE SAME Public/Granted day:2012-04-05
Information query
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