Invention Grant
- Patent Title: Method for activating a porous layer surface
- Patent Title (中): 激活多孔层表面的方法
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Application No.: US14555356Application Date: 2014-11-26
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Publication No.: US09117666B2Publication Date: 2015-08-25
- Inventor: Quoc Toan Le , Mikhail Baklanov , Yiting Sun , Silvia Armini
- Applicant: IMEC VZW , Katholieke Universiteit Leuven, KU LEUVEN R&D
- Applicant Address: BG Leuven BE Leuven
- Assignee: IMEC VZW,Katholieke Universiteit Leuven, KU Leuven R&D
- Current Assignee: IMEC VZW,Katholieke Universiteit Leuven, KU Leuven R&D
- Current Assignee Address: BG Leuven BE Leuven
- Agency: Knobbe Martens Olson & Bear, LLP
- Priority: EP13197472 20131216
- Main IPC: H01L21/469
- IPC: H01L21/469 ; H01L21/02
Abstract:
A method is provided for activating an exposed surface of a porous dielectric layer, the method comprising the steps of: filling with a first liquid at least the pores present in a part of the porous dielectric layer, the part comprising the exposed surface, removing the first liquid selectively from the surface, activating the exposed surface, and removing the first liquid from the bulk part of the porous dielectric layer.
Public/Granted literature
- US20150170910A1 METHOD FOR ACTIVATING A POROUS LAYER SURFACE Public/Granted day:2015-06-18
Information query
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