发明授权
- 专利标题： Wafer-level device packaging
- 专利标题（中）： 晶圆级装置包装
-
申请号： US13551610申请日： 2012-07-18
-
公开(公告)号： US09117715B2公开(公告)日： 2015-08-25
- 发明人: Yat Kit Tsui , Dan Yang , Pui Chung Law
- 申请人： Yat Kit Tsui , Dan Yang , Pui Chung Law
- 申请人地址： CN Hong Kong Science Park, Shatin, New Territories, Hong Kong
- 专利权人： Hong Kong Applied Science and Technology Research Institute Company Limited
- 当前专利权人： Hong Kong Applied Science and Technology Research Institute Company Limited
- 当前专利权人地址： CN Hong Kong Science Park, Shatin, New Territories, Hong Kong
- 代理机构： Ella Cheong Hong Kong
- 代理商 Sam T. Yip
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/00 ; H01L27/146 ; H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L23/00
摘要：
The present invention relates to a semiconductor device packaged at the wafer level such that an entire packaged device is formed prior to separation of individual devices. The semiconductor device package includes a semiconductor chip having one or more bonding pads associated with the chip and a protective layer bonded over the semiconductor chip. An insulation layer is positioned on at least side edges and a lower surface of the semiconductor chip. Interconnection/bump metallization is positioned adjacent one or more side edges of the semiconductor chip and is electrically connected to at least one bonding pad. A compact image sensor package can be formed that is vertically integrated with a digital signal processor and memory chip along with lenses and a protective cover.
公开/授权文献
- US20140021596A1 WAFER-LEVEL DEVICE PACKAGING 公开/授权日：2014-01-23
信息查询
IPC分类:
