Invention Grant
- Patent Title: Endpointing detection for chemical mechanical polishing based on spectrometry
- Patent Title (中): 基于光谱法的化学机械抛光的终点检测
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Application No.: US14010193Application Date: 2013-08-26
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Publication No.: US09117751B2Publication Date: 2015-08-25
- Inventor: Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/66 ; B24B37/013 ; B24B37/20 ; B24B49/08 ; B24B49/12 ; B24D7/14 ; H01L21/3105 ; H01L21/321

Abstract:
Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
Public/Granted literature
- US20130344625A1 ENDPOINTING DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECTROMETRY Public/Granted day:2013-12-26
Information query
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