Invention Grant
US09117806B2 Light emitting device mount, light emitting apparatus including the same, and leadframe
有权
发光装置安装件,包括该装置的发光装置和引线框架
- Patent Title: Light emitting device mount, light emitting apparatus including the same, and leadframe
- Patent Title (中): 发光装置安装件,包括该装置的发光装置和引线框架
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Application No.: US14211051Application Date: 2014-03-14
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Publication No.: US09117806B2Publication Date: 2015-08-25
- Inventor: Ryohei Yamashita , Ryoichi Yoshimoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2013-052297 20130314
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L23/495 ; H01L33/62 ; H01L23/00

Abstract:
A mount includes a terminal, and a resin portion. The terminal includes a first surface, a second surface, and an end surface having first and second recessed areas that are extend from the first and second surfaces, respectively. The resin portion is integrally formed with the terminal, and at least partially covers the end surface so that the first and second surfaces are at least partially exposed. The resin portion forms a recessed part to accommodate the light emitting device. The second recessed area includes a closest point that is positioned closest to the first surface, and an extension part that extends outward of the closest point and toward the second surface side. The extension part is formed at least on opposing end surfaces of the pair of positive and negative lead terminal. The first recessed area is arranged on the exterior side relative to the closest point.
Public/Granted literature
- US20140264426A1 LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE SAME, AND LEADFRAME Public/Granted day:2014-09-18
Information query
IPC分类: