Invention Grant
US09118129B2 Fuse unit, mold structure, and molding method using mold structure
有权
保险丝单元，模具结构和使用模具结构的成型方法
- Patent Title: Fuse unit, mold structure, and molding method using mold structure
- Patent Title (中): 保险丝单元，模具结构和使用模具结构的成型方法
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Application No.: US13712305Application Date: 2012-12-12
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Publication No.: US09118129B2Publication Date: 2015-08-25
- Inventor: Shinya Onoda
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-135161 20100614
- Main IPC: H01R4/60
- IPC: H01R4/60 ; H01R13/11 ; H01R25/14 ; H01H69/02 ; H01H85/045 ; H01H85/10 ; H01H85/02
Abstract:
A mold structure includes a fixed mold and a movable mold to bury a bus bar having a main body circuit unit with a tuning-fork terminal along with molding of a resin molded product. The fixed mold and the movable mold being joined together are configured to nip a terminal base of the tuning-fork terminal between a terminal base receiving portion of the fixed mold and a terminal base abut portion of the movable mold in a state where the tuning-fork terminal is protruded outside a cavity which is formed by mold main body portions of the fixed mold and the movable mold being joined together and into which resin is injected.
Public/Granted literature
- US20130102205A1 FUSE UNIT, MOLD STRUCTURE, AND MOLDING METHOD USING MOLD STRUCTURE Public/Granted day:2013-04-25
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