A cover assembly for covering a pivot of an electronic device is disclosed. The pivot connects a first component and a second component of the electronic device. The cover assembly is disposed at one side of the pivot, and the cover assembly includes a first covering element and a second covering element. A first end of the first covering element is connected to the first component, and a second end of the first covering element includes a first limit part. A first end of the second covering element is connected to the second component, and a second end of the second covering element includes a second limit part. The first covering element is overlapped with the second covering element. When the pivot rotates, the first limit part and the second limit part move correspondingly.