Invention Grant
- Patent Title: Flexible circuit board
- Patent Title (中): 柔性电路板
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Application No.: US13781863Application Date: 2013-03-01
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Publication No.: US09119302B2Publication Date: 2015-08-25
- Inventor: Yoshihiro Hattori , Shozo Asai
- Applicant: CANON COMPONENTS, INC.
- Applicant Address: JP
- Assignee: CANON COMPONENTS, INC.
- Current Assignee: CANON COMPONENTS, INC.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2012-046914 20120302; JP2012-281408 20121225
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K3/40 ; H05K1/03
Abstract:
A flexible circuit board includes a base film formed by a metallic material, a first protective film formed on a first surface of the base film, and a circuit pattern adhered to the first protective film through an adhesive film. Projections and recesses for heat release are formed on a second surface that is a surface on the opposite side of the first surface of the base film.
Public/Granted literature
- US09072182B2 Flexible circuit board Public/Granted day:2015-06-30
Information query
