Invention Grant
- Patent Title: Multi-step cutting process
- Patent Title (中): 多步切割过程
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Application No.: US13623595Application Date: 2012-09-20
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Publication No.: US09120179B2Publication Date: 2015-09-01
- Inventor: Anthony J. Richter , Dale N. Memering , Vincent Yan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: B28D5/00
- IPC: B28D5/00 ; B23K26/38 ; B28D1/22 ; B23K26/40 ; B23K26/30

Abstract:
Methods related to efficient processing of sapphire are discussed which are expected to both speed manufacture of corundum for applications and make the use of conundrum cost effective. In particular, one embodiment may take the form of a method of cutting a hard transparent material having a polished surface. The method includes roughening the polished surface, directing a laser beam at the hard transparent material to melt the material and removing the melted hard material.
Public/Granted literature
- US20140076299A1 MULTI-STEP CUTTING PROCESS Public/Granted day:2014-03-20
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