Invention Grant
- Patent Title: Composite carrier frame for plastic injection molding
- Patent Title (中): 复合载体框架,用于塑料注射成型
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Application No.: US13740089Application Date: 2013-01-11
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Publication No.: US09120257B2Publication Date: 2015-09-01
- Inventor: Scott M. Nathanson
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: B29C45/14
- IPC: B29C45/14 ; G06F1/16 ; B29L31/34

Abstract:
Methods and devices for forming a composite carrier frame assembly used in an injection molding process are described. Methods and devices described herein are well suited for insert molding multiple small pieces into a single injection molded part. The composite carrier frame assembly can include a number of insert attached thereto that are positioned in a pre-determined arrangement such during an injection molding process the inserts are molded in a molded part in the pre-determined arrangement. Each insert can include an anchor portion arranged to be molded in the single injection molded part and an exterior portion arranged to be positioned exterior to the single injection molded part.
Public/Granted literature
- US20140199422A1 COMPOSITE CARRIER FRAME FOR PLASTIC INJECTION MOLDING Public/Granted day:2014-07-17
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