Invention Grant
- Patent Title: Silver based conductive layer for flexible electronics
- Patent Title (中): 用于柔性电子元件的银基导电层
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Application No.: US13715477Application Date: 2012-12-14
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Publication No.: US09121100B2Publication Date: 2015-09-01
- Inventor: Mohd Fadzli Anwar Hassan , Guowen Ding , Minh Huu Le , Minh Anh Anh Nguyen , Zhi-Wen Wen Sun , Guizhen Zhang
- Applicant: Intermolecular Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: C23C28/00
- IPC: C23C28/00 ; C23C30/00 ; H01L51/52 ; H01L51/00

Abstract:
Methods for making conducting stacks includes forming a doped or alloyed silver layer sandwiched between two layers of transparent conductive oxide such as indium tin oxide (ITO). The doped silver or silver alloy layer can be thin, such as between 1.5 to 20 nm and thus can be transparent. The doped silver or silver alloy can provide improved ductility property, allowing the conductive stack to be bendable. The transparent conductive oxide layers can also be thin, allowing the conductive stack to have an improved ductility property.
Public/Granted literature
- US20140170413A1 Silver Based Conductive Layer For Flexible Electronics Public/Granted day:2014-06-19
Information query
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