发明授权
- 专利标题: Laminated ceramic electronic component and manufacturing method therefor
- 专利标题(中): 层压陶瓷电子元件及其制造方法
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申请号: US13050977申请日: 2011-03-18
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公开(公告)号: US09123469B2公开(公告)日: 2015-09-01
- 发明人: Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Seiichi Nishihara , Kenichi Kawasaki , Shuji Matsumoto
- 申请人: Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Seiichi Nishihara , Kenichi Kawasaki , Shuji Matsumoto
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2010-067491 20100324
- 主分类号: H01G4/005
- IPC分类号: H01G4/005 ; H01G4/228 ; H01G4/12 ; H01G4/30
摘要:
In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.