发明授权
US09123552B2 Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same
有权
能够实现接口管芯和多个管芯堆叠之间的并发通信的装置，堆叠式器件中的交错导电路径以及用于形成和操作该管芯的方法
- 专利标题： Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same
- 专利标题（中）： 能够实现接口管芯和多个管芯堆叠之间的并发通信的装置，堆叠式器件中的交错导电路径以及用于形成和操作该管芯的方法
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申请号： US12750448申请日： 2010-03-30
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公开(公告)号： US09123552B2公开(公告)日： 2015-09-01
- 发明人: Brent Keeth , Christopher K. Morzano
- 申请人： Brent Keeth , Christopher K. Morzano
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Schwegman Lundberg & Woessner, P.A.
- 主分类号： G06F13/14
- IPC分类号： G06F13/14 ; H01L25/065 ; G11C5/02 ; G06F13/38 ; H01L23/31 ; H01L23/48 ; H01L25/18
摘要：
Various embodiments include apparatuses, stacked devices and methods of forming dice stacks on an interface die. In one such apparatus, a dice stack includes at least a first die and a second die, and conductive paths coupling the first die and the second die to the common control die. In some embodiments, the conductive paths may be arranged to connect with circuitry on alternating dice of the stack. In other embodiments, a plurality of dice stacks may be arranged on a single interface die, and some or all of the dice may have interleaving conductive paths.
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