发明授权
- 专利标题： Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof
- 专利标题（中）： 具有前端热接触的微电子封装及其制造方法
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申请号： US13942518申请日： 2013-07-15
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公开(公告)号： US09123685B2公开(公告)日： 2015-09-01
- 发明人: Weng Foong Yap , Douglas G. Mitchell
- 申请人： Weng Foong Yap , Douglas G. Mitchell
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR INC.
- 当前专利权人地址： US TX Austin
- 代理机构： Ingrassia Fisher & Lorenz, P.C.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/367 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L23/538
摘要：
Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes forming one or more redistribution layers over an encapsulated die having a frontside bond pad area and a frontside passivated non-bond pad area. The redistribution layers are formed to have a frontside opening over the non-bond pad area of the encapsulated die. A primary heat sink body is provided in the frontside opening and thermally coupled to the encapsulated die. A contact array is formed over the redistribution layers and is electrically coupled to a plurality bond pads located on the frontside bond pad area of the encapsulated die.
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