发明授权
- 专利标题： Wiring member and semiconductor module having the same
- 专利标题（中）： 具有相同的接线构件和半导体模块
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申请号： US13895903申请日： 2013-05-16
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公开(公告)号： US09123711B2公开(公告)日： 2015-09-01
- 发明人: Toshihiro Fujita , Hiroyasu Kidokoro , Hiromasa Hayashi
- 申请人： DENSO CORPORATION
- 申请人地址： JP Kariya
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya
- 代理机构： Nixon & Vanderhye PC
- 优先权： JP2012-113411 20120517
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00
摘要：
A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a first conductive portion. The second leg portion is electrically connected to a second conductive portion. The third leg portion is electrically connected to a third conductive portion. The first connecting wall connects the first leg portion and the second leg portion. The second connecting wall connects the second leg portion and the third leg portion. The first leg portion, the second leg portion, and the third leg portion are non-linearly arranged.
公开/授权文献
- US20130307129A1 WIRING MEMBER AND SEMICONDUCTOR MODULE HAVING THE SAME 公开/授权日：2013-11-21
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