发明授权
- 专利标题： Transmission line via structure
- 专利标题（中）： 传输线通过结构
-
申请号： US14280223申请日： 2014-05-16
-
公开(公告)号： US09123738B1公开(公告)日： 2015-09-01
- 发明人: David M. Mahoney , Mohsen H. Mardi
- 申请人： Xilinx, Inc.
- 申请人地址： US CA San Jose
- 专利权人： XILINX, INC.
- 当前专利权人： XILINX, INC.
- 当前专利权人地址： US CA San Jose
- 代理商 Robert Brush
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L21/44 ; H01L23/66 ; H01L21/768
摘要：
In a transmission line via structure, a plurality of sub-structures are stacked in a via through the substrate along a longitudinal axis thereof. Each of the sub-structures includes a center conductor portion, an outer conductor portion, and at least one dielectric support member. The center conductor portion extends along the longitudinal axis. The outer conductor portion is disposed around the center conductor portion. The dielectric support member(s) separate the outer conductor portion and the center conductor portion and provide a non-solid volume between the outer conductor portion and the center conductor portion. Conductive paste is disposed between the center and outer conductor portions of successive ones of the plurality of sub-structures to form an outer conductor and a center conductor.
信息查询
IPC分类:
